• vexis000741
  • vexis00078
  • vexis00079
  • vexis00077
Product name: 

A filler is added under the BGA encapsulated part to protect the solder, and the larger parts are soldered to the PCB. The VEXiS equipment is used for measuring the position and volume of the filler and adhesive. 2 AOIs were made for two production lines.